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Services: microelectronic packaging, integrated circuit packaging, IC packaging,Hi-Rel, die attach, wire bonding, mil std 883, hermetic, class S, class B, multi chip modules, MCM, MCM-C, MCM-H, MCM-L, MCM-D, surface mount modules, hybrids, mil-spec testing, memory modules, military, burn-in testing, ISO 9000, chip, microchip, custom package design, environmental screening, obsolete microcircuits

SAC-TEC LABS, INC SAC-TEC MICRO-DEVICES INC.
Sac-Tec, Torrance


The Company

SAC-TEC is a small company that specializes in the engineering, manufacturing and testing of customized microelectronic components for Aerospace applications. With facilities in California and Maryland, SAC-TEC supports the Aerospace industry's need for unique and Hi-Rel components. Both facilities are equipped with extensive test capabilities and high reliability clean rooms. SAC-TEC has far-reaching experience in acquiring hard-to-find obsolete die and components as well as broad experience in the re-engineering of components. SAC-TEC can up-screen components on-site to meet virtually any specification standard or Source Control Drawing.

Engineering Experience

Together, SAC-TEC's engineering staff consists of the disciplines necessary for microcircuit products and component performance. SAC-TEC's knowledge base includes semiconductor silicon design foundry processes, characterization and qualification of components, advanced package assembly techniques, multi-chip modules, memory modules, hybrids, full implementation of military and defense standards, as well as document and drawing preparation of SCD', SID's, and SoCD's. No matter what your specification may be, SAC-TEC is ready to solve your most demanding requirements in semiconductor products. SAC-TEC can successfully coordinate customer designs with semiconductor OEM availability to provide a final working product. SAC-TEC is constantly meeting the challenges of increasing complexity and costs of military hardware design while offering options and cost/time-saving procedures.

Manufacturing

The multi-site manufacturing capabilities of the SAC-TEC Group include state-of-the-art production equipment in both semi-automatic and automatic systems for die attach , wire bond and test. These automated production methods minimize operator error and ensure lot-to-lot consistency. We maintain the strict environmental controls necessary in microcircuit manufacturing.

Products

SAC-TEC manufactures the following Hi-Rel semiconductors and microcircuits:

  • Hybrid Circuits (Memory Modules, Power Drivers, SCDs)
  • Integrated Circuits (Digital, Linear, Analog, Memory, Microprocessors)
  • ASICs, Gate Arrays, Microcontrollers
  • Discrete Circuits (Transistors, FETs, Diodes, SCRs, Triacs)
  • Power Circuits
  • Passive Circuits (Resistors, Capacitors, Inductors, Arrays)

Custom Packaging is available in:

  • Flat Packs
  • LCC
  • Quad Pack
  • DIPs
  • PGAs
  • SIPs
  • Ceramic Substrates
  • Leaded Chip Carriers Power TOs

Technical Standards

SAC-TEC manufactures and tests all products to customer provided Source Control Drawings (SCD) or to SAC-TEC internal manufacturing procedures based upon the Military standards and references listed below. All products produced at SAC-TEC are either marked with customer part numbers or SAC-TEC assigned part number, date code and FSCM identifier. The devices manufactured by SAC-TEC are not covered by the QML/QPL associated with the referenced specifications. SAC-TECís Quality System is configured to meet Mil-I-45208A requirements.

  • Mil-H-38534
  • Mil-PER-38535
  • Mil-I-38535
  • Mil-M-38510
  • Misl-S-19500
  • Mil-Std-750
  • Mil-Std-883

In house process methods:

  • 5004 (100% screen)
  • 5005 (QCI lot)
  • 5007 (Wafer)
  • 5008 (Element)

Facilities

  • Torrance, CA, 10,000 sq. ft. with 1250 sq. ft. class 10K clean room, class 100 work stations for exposed die and package operations. Supports assembly, test, environmental screening and FA/DPA activities.
  • Frederick, MD, 15,000 sq. ft. with 1,000 sq. ft.class 10K in ceramic substrate screening/printing operations, 1250 sf. ft. class 10K clean room in hybrid assembly. Class 100 work stations for exposed die and package operations. This facility supports hybrid & MCM module assembly, surface mount modules, test and environmental screening.
©2004 Sac-Tec Labs, Inc.