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Services:
microelectronic packaging, integrated circuit packaging,
IC packaging,Hi-Rel, die attach, wire bonding, mil std
883, hermetic, class S, class B, multi chip modules, MCM,
MCM-C, MCM-H, MCM-L, MCM-D, surface mount modules,
hybrids, mil-spec testing, memory modules, military,
burn-in testing, ISO 9000, chip, microchip, custom
package design, environmental screening, obsolete
microcircuits
SAC-TEC LABS, INC |
SAC-TEC MICRO-DEVICES
INC. |
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The Company
SAC-TEC is a small company that
specializes in the engineering, manufacturing and testing
of customized microelectronic components for Aerospace applications. With facilities in California and
Maryland, SAC-TEC supports the Aerospace industry's need for unique and Hi-Rel components. Both
facilities are equipped with extensive test capabilities
and high reliability clean rooms. SAC-TEC has
far-reaching experience in acquiring hard-to-find
obsolete die and components as well as broad experience
in the re-engineering of components. SAC-TEC can
up-screen components on-site to meet virtually any
specification standard or Source Control Drawing.
Engineering Experience
Together, SAC-TEC's engineering staff consists of the disciplines necessary for microcircuit
products and component performance. SAC-TEC's knowledge
base includes semiconductor silicon design foundry
processes, characterization and qualification of
components, advanced package assembly techniques,
multi-chip modules, memory modules, hybrids, full
implementation of military and defense standards, as well
as document and drawing preparation of SCD', SID's, and
SoCD's. No matter what your specification may be, SAC-TEC
is ready to solve your most demanding requirements in
semiconductor products. SAC-TEC can successfully
coordinate customer designs with semiconductor OEM
availability to provide a final working product. SAC-TEC
is constantly meeting the challenges of increasing complexity and costs of military hardware design while
offering options and cost/time-saving procedures.
Manufacturing
The multi-site manufacturing
capabilities of the SAC-TEC Group include
state-of-the-art production equipment in both semi-automatic and automatic systems for die attach ,
wire bond and test. These automated production methods
minimize operator error and ensure lot-to-lot
consistency. We maintain the strict environmental
controls necessary in microcircuit manufacturing.
Products
SAC-TEC manufactures the following
Hi-Rel semiconductors and microcircuits:
- Hybrid Circuits (Memory Modules,
Power Drivers, SCDs)
- Integrated Circuits (Digital,
Linear, Analog, Memory, Microprocessors)
- ASICs, Gate Arrays,
Microcontrollers
- Discrete Circuits (Transistors,
FETs, Diodes, SCRs, Triacs)
- Power Circuits
- Passive Circuits (Resistors,
Capacitors, Inductors, Arrays)
Custom Packaging is available in:
- Flat Packs
- LCC
- Quad Pack
- DIPs
- PGAs
- SIPs
- Ceramic Substrates
- Leaded Chip Carriers Power TOs
Technical Standards
SAC-TEC manufactures and tests all products to customer provided
Source Control Drawings (SCD) or to SAC-TEC internal manufacturing
procedures based upon the Military standards and references listed below.
All products produced at SAC-TEC are either marked with customer part numbers
or SAC-TEC assigned part number, date code and FSCM identifier. The devices
manufactured by SAC-TEC are not covered by the QML/QPL associated with the
referenced specifications. SAC-TEC’s Quality System is configured to meet
Mil-I-45208A requirements.
- Mil-H-38534
- Mil-PER-38535
- Mil-I-38535
- Mil-M-38510
- Misl-S-19500
- Mil-Std-750
- Mil-Std-883
In house process methods:
- 5004 (100% screen)
- 5005 (QCI lot)
- 5007 (Wafer)
- 5008 (Element)
Facilities
- Torrance, CA, 10,000 sq. ft. with 1250
sq. ft. class 10K clean room, class 100 work
stations for exposed die and package operations.
Supports assembly, test, environmental screening
and FA/DPA activities.
- Frederick, MD, 15,000 sq. ft. with 1,000
sq. ft.class 10K in ceramic substrate
screening/printing operations, 1250 sf. ft. class
10K clean room in hybrid assembly. Class 100 work
stations for exposed die and package operations.
This facility supports hybrid & MCM module
assembly, surface mount modules, test and
environmental screening.
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