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Multi
Chip Modules
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microelectronic packaging, integrated circuit
packaging, IC packaging,Hi-Rel, die attach, wire
bonding, mil std 883, hermetic, class S, class B,
multi chip modules, MCM, MCM-C,MCM-H, MCM-L,
MCM-D, surface mount modules, hybrids, mil-spec
testing, memory modules, military, burn-in
testing, ISO 9000,chip, microchip, custom package
design, environmental screening,obsolete
microcircuits |
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The former Fairchild hybrid
facility, now incorporated as SAC-TEC Micro
Devices, Inc. was designed and constructed
specifically for the production of thick film
substrates and the assembly of Hybrid and High
Density Memory Modules. Over 30% of the total
area is devoted to Class 10,000 clean room and is
fully equipped with electrical and environmental
screening instrumentation. SAC-TEC can fulfill
your custom MCM needs at any level from
"black box" specifications to industry
standard designs, to the production of customer
designed prototype circuits. SAC-TEC offers extensive
capabilities in the design and fabrication of
High Temperature Cofired Ceramic, Low Temperature
Cofired Ceramic and Thick Film Multi Chip Modules
for military, space and other high reliability
applications using advanced manufacturing
techniques in substrate fabrication, die-attach,
wire bond, and specialized packaging
applications.
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SAC-TEC
Offers:
- MCM-C MCM-L MCM-H MCM-D
- Extreme tolerances
- 100% screening to military specification
- Automatic and semi-automatic wire bond
and die attach
- Burn-in aging
- Full electrical testing at temperature
extremes
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©2004
Sac-Tec Labs, Inc.
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