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Multi Chip Modules

Custom Hybrid Circuits and Memory Modules

Multi Chip Modules

Services: microelectronic packaging, integrated circuit packaging, IC packaging,Hi-Rel, die attach, wire bonding, mil std 883, hermetic, class S, class B, multi chip modules, MCM, MCM-C,MCM-H, MCM-L, MCM-D, surface mount modules, hybrids, mil-spec testing, memory modules, military, burn-in testing, ISO 9000,chip, microchip, custom package design, environmental screening,obsolete microcircuits

The former Fairchild hybrid facility, now incorporated as SAC-TEC Micro Devices, Inc. was designed and constructed specifically for the production of thick film substrates and the assembly of Hybrid and High Density Memory Modules. Over 30% of the total area is devoted to Class 10,000 clean room and is fully equipped with electrical and environmental screening instrumentation.

SAC-TEC can fulfill your custom MCM needs at any level from "black box" specifications to industry standard designs, to the production of customer designed prototype circuits. SAC-TEC offers extensive capabilities in the design and fabrication of High Temperature Cofired Ceramic, Low Temperature Cofired Ceramic and Thick Film Multi Chip Modules for military, space and other high reliability applications using advanced manufacturing techniques in substrate fabrication, die-attach, wire bond, and specialized packaging applications.


SAC-TEC Offers:

  • Extreme tolerances
  • 100% screening to military specification
  • Automatic and semi-automatic wire bond and die attach
  • Burn-in aging
  • Full electrical testing at temperature extremes
2004 Sac-Tec Labs, Inc.