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Aerospace Components
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microelectronic packaging, integrated circuit
packaging, IC packaging,Hi-Rel, die attach, wire
bonding, mil std 883, hermetic, class S, class B,
multi chip modules, MCM, MCM-C,MCM-H, MCM-L,
MCM-D, surface mount modules, hybrids, mil-spec
testing, memory modules, military, burn-in
testing, ISO 9000,chip, microchip, custom package
design, environmental screening,obsolete
microcircuits |
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SAC-TEC provides unique metal or
ceramic housings to meet each customer's
mechanical, thermal, or power handling needs.
SAC-TEC offers both standard or customized
process flows tailored to the Hi-Rel applications
of our customers. When time is of the essence,
SAC-TEC has rescued projects from late delivery
by exercising emergency product builds. A
component which may take up to 50 weeks to
finally ship from major semiconductor OEMs can
normally be delivered from SAC-TEC in 20 weeks or
less. SAC-TEC has, under severe conditions,
delivered a Class S product in 7 weeks. |
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SAC-TEC
Offers:
- Hi-Rel Aerospace and Special
Industrial packaging
- Smaller footprints
- Standard and Custom Hermetic Package
Design
- Power Packages, Metal Seam,
Chip-On-Board, Ceramic
- Monolithic, Hybrid and MCM Assemblies
- Better thermal characteristics
- Epoxy, Eutectic, Thermoplastic and Silver
Glass Die Attach
- Improved electrical characteristics
- Gold and Aluminum Wire Bond 0.7 to 20 Mil
- Full electrical evaluation (Group A)
- Destructive Physical Analysis (Group B)
- 1000 hour life tests (Group C)
- Package integrity testing (Group D)
- Process Screens to Method 5004 and 5005
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©2001
Sac-Tec Labs, Inc.
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