• Burn-In
• Die Shear
• Bond Pull (Destruct and Non-Destruct)
• Resistance to solvents
• Residual Gas Analysis
• Solderability
• Lead Integrity
• Fine and Gross Leak
• Constant Acceleration
• Temperature Cycling
• Moisture Resistance
• Salt Atmosphere Spray
• Mechanical Shock
• Variable Vibration
• Particle Impact Noise Detection (PIND)
• X-Ray
• Scanning Electron Microscope (SEM)
• Destructive Part Analysis (DPA)

©2001 Sac-Tec Labs, Inc.