Wafer Handling

• Wafer Probing for "special" electrical selections
• Wafer Lot Acceptance, Method 5007
• Scanning Electron Microscope (SEM)

Visual Inspection

• Mil-Std-883, Method 2010, conditions A and B
• Mil-Std-750, Methods 2072 and 2073

Lot Acceptance Testing

• Element Evaluation, Method 5008, Class S and B
• Bondability Tests, Die Shear and Wire Pull
• Data Attributes, Variables and Delta Analysis
• Variations per customer specifications

Prom and Pal Programming

• Pattern and Vector Generation.
• Learned Algorithm and Pattern Sensitivities
• Pattern Burn-in and Identification

Customized Services

• Parametric Selection, Method 5001 and 5002
• Wafer Mapping
• Pairs, Sets and Parametric "Cherry" Matching

©2001 Sac-Tec Labs, Inc.